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Mechanical Specifications
58
Intel® Xeon® Processor 7400 Series Datasheet
Figure 3-7.
Board Mounti
ng-Hole Keepout Zones
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2
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Datasheet
1
Contents
3
Revision History
7
1 Introduction
9
1.1 Terminology
11
Introduction
12
1.2 State of Data
13
1.3 References
13
2 Electrical Specifications
15
2.2 Decoupling Guidelines
16
Clocking
16
2.3.2 PLL Power Supply
18
Electrical Specifications
20
Table 2-4. FSB Signal Groups
21
Asynchronous Signals
22
2.9 Mixing Processors
23
Time Duration (s)
28
Sustained Current (A)
28
Table 2-10. V
30
Figure 2-4. V
31
2.11.2 V
33
Overshoot Specification
33
2.11.3 Die Voltage Validation
33
2.11.4.1 DC Characteristics
34
2.12 AGTL+ FSB Specifications
35
Tp = T1: BCLK[1:0] period
42
THERMTRIP#
46
System bus
48
FERR#/PBE#
48
Figure 2-22. VID Step Timings
49
3 Mechanical Specifications
51
Mechanical Specifications
52
3.7 Processor Materials
61
3.8 Processor Markings
62
Processor
63
4 Pin Listing
65
(Sheet 3 of 16)
66
(Sheet 4 of 16)
66
(Sheet 5 of 16)
67
(Sheet 6 of 16)
67
(Sheet 7 of 16)
68
(Sheet 8 of 16)
68
(Sheet 9 of 16)
69
(Sheet 10 of 16)
69
(Sheet 11 of 16)
70
(Sheet 12 of 16)
70
(Sheet 13 of 16)
71
(Sheet 14 of 16)
71
(Sheet 15 of 16)
72
(Sheet 16 of 16)
72
(Sheet 1 of 14)
73
(Sheet 2 of 14)
73
(Sheet 3 of 14)
74
(Sheet 4 of 14)
74
(Sheet 5 of 14)
75
(Sheet 6 of 14)
75
(Sheet 7 of 14)
76
(Sheet 8 of 14)
76
(Sheet 9 of 14)
77
(Sheet 10 of 14)
77
(Sheet 11 of 14)
78
(Sheet 12 of 14)
78
(Sheet 13 of 14)
79
(Sheet 14 of 14)
79
Pin Listing
80
5 Signal Definitions
81
FSB agents
85
. The processor includes
86
6 Thermal Specifications
89
CASE_MAX
90
CASE (°C)
91
= 0.431 x Power + 45
95
Power (W)
96
Temperature (C)
96
6.1.2 Thermal Metrology
97
6.2.2 Intel Thermal Monitor
97
6.2.3 Intel Thermal Monitor 2
98
6.2.4 On-Demand Mode
99
6.2.5 PROCHOT# Signal
100
6.2.6 FORCEPR# Signal
100
6.2.7 THERMTRIP# Signal
100
6.3.1 Introduction
101
6.3.1.1 T
102
6.3.2.1 PECI Device Address
103
6.3.2.2 PECI Command Support
103
7 Features
105
7.2.2.1 HALT State
106
7.2.2.2 Extended HALT State
106
7.2.3 Stop-Grant State
108
7.3 Enhanced Intel SpeedStep
109
Technology
109
Features
110
7.4.1 SMBus Device Addressing
111
Transactions
112
7.4.3.1 Header
115
7.4.3.2 Processor Data
119
0Eh-13h
120
7.4.3.3 Processor Core Data
121
Offset: 1Ah-1Bh
122
7.4.3.4 Cache Data
124
Offset: 29h-2Ah
125
2Bh-2Ch
125
2Dh-2Eh
125
7.4.3.5 Package Data
126
7.4.3.6 Part Number Data
127
38h-3Eh
128
3Fh-4Ch
128
4Dh=54h
128
55h-6Eh
128
71h-72h
129
7.4.3.8 Feature Data
130
7.4.3.9 OD: Other Data
131
7.4.4 Checksums
132
7.4.5 Scratch EEPROM
132
8 Debug Tools Specifications
133
Debug Tools Specifications
134
9.1 Introduction
135
9.2 Thermal Specifications
135
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